Technological Innovations for Failure Analysis Market

The Failure Analysis Market is projected to USD 5.9 Billion by 2025 from USD 4.7 billion in 2022 at a CAGR of 8.3% during the forecast period. It was observed that the growth rate was 3.91% from 2021 to 2022. Focused Ion Beam Equipment segment is expected to grow at a highest CAGR of 6.13%.

Failure analysis equipment is responsible for animating and analyzing the root cause of a failure of a product, device, or system. The failure analysis market report covers several types of failure analysis equipment such as an optical microscope, scanning probe microscope, Transmission Electron Microscope (TEM), Scanning Electron Microscope (SEM), Focused Ion Beam (FIB), and dual beam system.

Failure analysis is a process that includes data collection and analysis for failure determination. Detail information, that is, how the component was procured, how it was stored before delivery, how it was handled, its location in the circuit (if mounted), how it was biased, and for how long, environmental conditions, and failure mode or degraded performance, is crucial to avoid any unprecedented damage. For instance, chips used in semiconductor devices are becoming highly integrated, and products with advanced functions have been introduced in recent years, such as multiple chips mounted in a single package. As a result, manufacturing processes are becoming more miniaturized and complex, and failure causes and mechanisms are also diversifying and becoming more complex. When manufacturing semiconductors, consistent quality and reliability must be built in from the development stage to the manufacturing stage to prevent semiconductor devices from failing and underperforming.

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Failure analysis market for focused ion beam (FIB) systems is expected to grow at the highest CAGR during the forecast period
The Focused Ion Beam (FIB) market is expected to grow at the highest CAGR during the forecast period. FIBS are primarily used for semiconductor manufacturing. The development of commercially focused FIBS has led to their increased applications in the field of material sciences. In addition to circuit editing and Transmission Electron Microscopy (TEM) sample preparation, FIBs can now be used for microstructural analysis and prototyping nanomachining. The fastest growth of this segment can be attributed to the growing adoption of FIB systems in material science and bioscience applications.

The failure analysis market for Energy Dispersive X-Ray Spectroscopy (EDX) to hold the largest share during the forecast period
Energy Dispersive X-ray Spectroscopy (EDX or EDS) is an analytical capability that can be coupled with several applications, including Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), and Scanning Transmission Electron Microscopy (STEM). EDX, when combined with these imaging tools, can provide elemental analysis on areas as small as nanometers in diameter. In a multi-technique approach, EDX becomes very powerful, particularly in contamination analysis and industrial forensic science investigations.

Failure analysis market for semiconductors and electronics to hold the largest share during the forecast period.
The growing demand for miniature transistor chips, nanoelectronics, quantum dots, and optoelectronics is driving the market for failure analysis in the semiconductor industry. The electronics & semiconductor industry is one of the growing sectors globally, owing to the increased adoption of robotics and automation to produce electronic devices. The electronics & semiconductor industry requires high-density, integrated, and miniaturized devices. These requirements have led to the development of 3D Integrated Circuits (ICs) that make it possible to incorporate extensive functionalities into fast, small, and low-power-consumption devices. However, these dense ICs require sophisticated development, prototyping, inspection, and failure analysis tools.

The Asia Pacific region is projected to grow at the highest CAGR during the forecast period
The mass production of electronic products such as smartphones, tablets, sensors, industrial equipment, wearables, and white goods in China and Taiwan is expected to accelerate the growth of the regional failure analysis market. Japan is the largest market for microscopy equipment in the Asia Pacific region. Major market players such as Nikon, JEOL Ltd., Olympus, and Hitachi High-Technologies are headquartered in Japan. They have a strong customer base in the country, including several large research institutes and pharmaceutical & biotechnology companies. China's manufacturing sector is using industrial robots to automate and modernize various manufacturing processes. This trend has led to the requirement for monitoring device failure, thus offering new growth opportunities for the failure analysis market in the country.

Key Players:
Thermo Fisher Scientific, Inc. (US), Hitachi High-Technologies Corporation (Japan), Carl Zeiss (Germany), JOEL, Ltd. (Japan), TESCAN OSRAY HOLDING (Czech Republic), Bruker (US), Intertek Group Plc (UK), Nikon Metrology (Belgium), Semilab (Hungary), A&D Company, Ltd. (Japan), Nanosurf AG (Switzerland), HORIBA, Ltd. (Japan), Leica Microsystems GmbH (Germany), Veeco Instruments (US), Oxford Instruments (UK), Eurofins Scientific (Luxembourg), Olympus Corporation (Japan).