According
to the new market research report on the "Silicon on Insulator
(SOI) Market by Wafer Size (200 mm and less than 200 mm, 300 mm), Wafer
Type (RF-SOI, FD-SOI), Technology (Smart Cut, Layer Transfer), Product (RF FEM,
MEMS), Application (Consumer Electronics, Automotive) - Global Forecast to
2025", published by MarketsandMarkets™, the global Silicon On
Insulator (SOI) Market size is projected to grow from USD 1.0 billion in 2020
to USD 2.2 billion by 2025, at a CAGR of 15.7% from 2020 to 2025. The improved
performance offered and low operating voltage required by SOI wafers, growing
use of SOI wafers in consumer electronics, and increase in investments by wafer
manufacturers and foundry players in the SOI ecosystem are factors driving the
growth of the SOI market across the globe.
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The
RF-SOI wafer type segment led the SOI market in 2019
The
RF-SOI wafer type segment accounted for the largest share of the SOI market in
2019. The growth of this segment can be attributed to the wide acceptance of
RF-SOI in advanced Long-term Evolution (LTE) smartphones. Almost all
smartphones use RF-SOI wafers in their RF Front-end Modules (FEMs) and antenna
switches. Leading players offering RF-SOI include Soitec (France), Shin-Etsu
Chemical (Japan), GlobalWafers Co., Ltd. (Taiwan), and Simgui (China).
Moreover,
foundry players are also launching new wafers based on RF-SOI in the market.
For instance, in September 2018, GlobalFoundries (US) started the production of
its mobile-optimized 8SW 300 mm based on the RF-SOI technology platform. 300 mm
RF-SOI is used in FEM applications, including 5G, IoT, and wireless
communication.
The
smart cut technology segment is estimated to account for the largest share of
the SOI market in 2020
The
smart cut technology segment is expected to lead the SOI market during the
forecast period. Smart cut technology is a proprietary technology of Soitec
(France) and is used for wafer bonding and layer splitting. Soitec offers this
technology to most of its wafer manufacturing partners, including Shin-Etsu
Chemical Co., Ltd. (Japan), and Simgui (China). Smart cut technology enables
wafer manufacturers to transfer a thin layer of crystalline material from one
substrate to another. Moreover, this technology is more flexible as compared to
other technologies. It offers high uniformity and excellent bonding interface
in wafers and controls their thickness variability.
Browse in-depth TOC on "Silicon on
Insulator Market"
130 – Tables
66 – Figures
192 – Pages
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Europe
is estimated to account for the largest share of the SOI market in 2020
Europe
is expected to lead the SOI market in 2020. The market in Europe is projected
to experience increased traction during the forecast period due to the presence
of several leading players such as Soitec (France) and STMicroelectronics N.V.
(Switzerland) in this region. Moreover, it is also a hub for automotive
players. Ongoing technological advancements in its automotive sector are
expected to increase the demand for SOI wafer-based products in the region,
thereby fueling the growth of the SOI market in Europe.
Soitec (France),
Shin-Etsu Chemical Co., Ltd (Japan), GlobalWafers Co., Ltd. (Taiwan), SUMCO (Japan),
Simgui (China), GlobalFoundries (US), STMicroelectronics N.V. (Switzerland),
TowerJazz (Israel), NXP Semiconductors N.V. (Netherlands), Murata Manufacturing
(Japan), Skyworks Solutions (US), Qorvo (US), Sony Corporation (Japan),
MagnaChip Semiconductor (South Korea), United Microelectronics Corporation
(Taiwan), Taiwan Semiconductor Manufacturing Company (Taiwan), Qualcomm
Technologies, Inc. (US), Silicon Valley Microelectronics (SVM), Inc. (US), EV
Group (US), Ultrasil LLC (US), Siltronix Silicon Technologies (France), and
WaferPro (US) are some of the major companies operating in the SOI market.