The semiconductor
manufacturing equipment market is projected to grow from USD 66.1 billion
in 2020 to USD 103.5 billion by 2025; it is expected to grow at a CAGR of 9.4%
from 2020 to 2025. Key factors fueling the growth of this market include the growing consumer electronics market, an increase in the number of foundries, and the trend of miniaturization and technology
migration.
Semiconductor manufacturing equipment is largely used by IDMs, OSAT,
and foundries to produce ICs. Semiconductor manufacturing equipment plays a key
role in the wafer development, testing, and assembly and packaging of
semiconductor devices during the fabrication process. Companies operating in this market offer 3 types of equipment—front-end, back-end, and fab facility
equipment. Semiconductor manufacturing equipment can be used to develop memory,
MPU, logic, discrete, analog, MEMS, and other semiconductor devices. The
equipment can be used to design the ICs in 2D, 2.5D, and 3D dimensions.
Request Free Sample
Report:
In 2019, the IDM firms segment captured the largest share in the semiconductor
manufacturing equipment market. Most of the tier 1 IDM companies such as Samsung (South Korea), Texas
Instruments (US), Sony Corporation (Japan), and STMicroelectronics
(Switzerland) have a significant presence
across the world, with a huge customer
base. IDMs use semiconductor manufacturing equipment for fabrication,
testing, assembly, and another process
of complicated semiconductor equipment with high accuracy, driving the growth
of the market. Also, the dominance of IMDs is expected to remain constant in the near future due to the increasing number
of semiconductor fabrication plants all over the world.
Among dimensions, the equipment for 3D IC manufacturing is expected to witness
the highest CAGR in the semiconductor manufacturing equipment market during the
forecast period. The demand for 3D ICs is increasing owing to its benefits such
as high performance under smaller footprints in various industries such as
military, aerospace, consumer electronics, telecommunication, and automotive. Some
players in Semiconductor Equipment and Materials International (SEMI) are
working on 3D IC standards. Three-dimensional stacked integrated circuits (3D-IC)
committee, formed in 2010, includes SEMI members, such as United Microelectronics Corp. (UMC) (Taiwan), Amkor Technology (US),
GlobalFoundries (US), Hewlett-Packard (US), and many more.
Among product type, the memory segment is expected to grow at the highest CAGR during the forecast period.
New technologies in memory, such as MRAM,
ZRAM, PCRAM, and RRAM are expected to
replace most of the traditional technologies. This shift in the memory market has demanded the change in
dynamics of manufacturing equipment, enforcing semiconductor manufacturing
equipment providers to develop more efficient designs for the device
manufacturers.
Download Free PDF
Brochure:
The semiconductor manufacturing equipment market in APAC is projected to grow at the
highest CAGR from 2020 to 2025. The commanding position of APAC is due to the
presence of a large number of OSAT companies in the region. More than 60% of
OSAT players present across the world have their headquarters in the APAC
region. These OSAT companies use semiconductor
manufacturing equipment in the semiconductor fabrication process. Taiwan and
South Korea contribute to a large number
of semiconductor foundries, showcasing larger demand for equipment. The Chinese
market is showing impressive growth owing to the cheap labor cost in the
country. These factors help the semiconductor manufacturing equipment market to
grow in the APAC region.
No comments:
Post a Comment