According to the
new market research report on the "Silicon
on Insulator Market by Wafer Size (200 mm and Less Than 200 mm, 300 mm),
Wafer Type (RF-SOI, FD-SOI), Technology (Smart Cut, Layer Transfer), Product
(RF FEM, MEMS), Application (Consumer Electronics, Automotive) - Global
Forecast to 2024", published by MarketsandMarkets™, the Silicon
on Insulator (SOI) market is projected to grow from USD
894 million in 2019 to USD 2,186 million by
2024, at a CAGR of 19.6% from 2019 to 2024.
Improved
performance offered and low operating voltage required by SOI wafers, growing
use of SOI wafers in consumer electronics, and increasing investments by wafer
manufacturers and foundry players in the SOI ecosystem are factors driving the
growth of the SOI market across the globe.
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The RF-SOI wafer type segment led the SOI
market in 2018.
The RF-SOI wafer type segment accounted for
the largest share of the SOI market in 2018. The growth of this segment can be
attributed to the wide acceptance of RF-SOI in advanced Long-term Evolution
(LTE) smartphones. Almost all smartphones use RF-SOI wafers in their RF
Front-end Modules (FEMs) and antenna switches. Leading players offering RF-SOI
include Soitec (France), Shin-Etsu Chemical (Japan), GlobalWafers (Taiwan),
and Simgui (China). Moreover, foundry players
are also launching new wafers based on RF-SOI in the market. For instance, in September 2018, GlobalFoundries (US) started the
production of its mobile-optimized 8SW 300 mm based on the RF-SOI technology platform.
300 mm RF-SOI is used in FEM applications, including 5G, IoT, and wireless
communication.
The smart cut technology segment is estimated
to account for the largest share of the SOI market in 2019.
The smart cut technology segment is expected
to lead the SOI market during the forecast period. Smart cut technology is a
proprietary technology of Soitec (France) and is
used for wafer bonding and layer splitting. Soitec offers this technology to
most of its wafer manufacturing partners, including Shin-Etsu Chemical (Japan) and Simgui (China).
Smart cut technology enables wafer manufacturers to transfer a thin layer of
crystalline material from one substrate to another. Moreover, this technology
is more flexible as compared to other technologies. It offers high uniformity
and excellent bonding interface in wafers and controls their thickness
variability.
Europe is
estimated to account for the largest share of the SOI market in 2019.
Europe is expected
to lead the SOI market in 2019. The market in Europe
is projected to experience increased traction during the forecast period due to
the presence of several leading players such as Soitec (France) and STMicroelectronics (Switzerland) in this region. Moreover, it is also a
hub for automotive players. Ongoing technological advancements in its
automotive sector are expected to increase the demand for SOI wafer-based
products in the region, thereby fueling the growth of SOI market in Europe.
Browse in-depth TOC on "Silicon on Insulator Market"
65 – Tables
50 – Figures
147 – Pages
Request Sample pages of the Report:
Soitec (France),
Shin-Etsu Chemical (Japan), GlobalWafers (Taiwan), SUMCO Corporation (Japan),
Simgui (China), GlobalFoundries (US), TowerJazz
(Israel), Sony (Japan),
WaferPro (US), STMicroelectronics N.V. (Switzerland),
NXP Semiconductor N.V. (Netherlands), Ineda
Systems (India), Evaderis (France), Murata Manufacturing (Japan), Skyworks Solutions (US), Qorvo (US), MagnaChip
Semiconductor (South Korea), UMC (Taiwan), TSMC (Taiwan),
Qualcomm (US), Silicon Valley Microelectronics (US), and EV Group (UK) are some
of the major companies operating in the SOI market.
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