The global automated optical inspection system market size is expected to reach USD 1,583 million by 2025, from USD 753 million in 2020, at a CAGR of 16.0%.
Koh Young (South Korea), Test Research, Inc. (Taiwan), Omron (Japan), Viscom(Germany), and Saki (Japan)are the leading players in the automated optical inspection (AOI)system market.
Automated optical inspection (AOI) systems are used for the inspection of printed circuit boards (PCBs). The system is superior and less time consuming compared to manual inspection. AOI systems are preliminarily used for the detection of defects such as soldering defects, component defects, and ball grid arrays (BGA), and chip-scale packaging (CSP) defects.
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Koh Young (South Korea)
Koh Young is among the leading manufacturers of AOI systems across the world. The company focuses on its R&D efforts to maintain its technical leadership in the field of optical inspection. In FY18, the company invested 12.6% of its overall revenue in R&D activities. Apart from R&D, the company has been implementing strategies such as product launches and expansions to rapidly expand its business operations worldwide. For instance, in May 2018, it opened a new R&D center in Suwon, South Korea, to develop innovative products. Moreover, in November 2017, Koh Young launched Zenith 2 AOI platform with Artificial Intelligence-driven (AI-driven) auto-programming software that reduces programming time by 70%.
Test Research, Inc. (Taiwan)
TRI offers the most robust product portfolio in the industry for automatic test and inspection solutions. The company’s product line-up is in line with the latest technological trends in industries, such as Industry 4.0 and smart factory applications. Its highly sophisticated after-sales services have also allowed it to gain recognition among world-class electronics manufacturing companies. Moreover, the company continually works toward upgrading and launching new AOI systems through its R&D activities. For instance, in March 2017, TRI launched its new top-of-the-line TR7700QE 3D AOI systems featuring an advanced 3D solder fillet inspection capability for zero-escape fault detection.
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